HAD205-P(D)CO
HAD205-D
Plane-type High-speed Die Bonder
Cycle: 60ms
Compatible with solder-paste printed SMD optocoupler, etc.
Features
1. International leading double die bond and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Automatic chip theta alignment system is applied on the Crystal frame;
5. Vacuum die missing testing technology is adopted;
6. Automatic up & down crystal rings and automatic inspection conveyor system is applied to improve the production efficiency largely;
7. IPC will control the operation of equipment, simplifying the operation of automation equipment;
8. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
9. Precise die bond location and excellent compatibility will guarantee the back-end processing.
Specifications and Parameters
Plane-type High-speed Die Bonder
Cycle: 60ms
Compatible with solder-paste printed SMD optocoupler, etc.
Features
1. International leading double die bond and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Automatic chip theta alignment system is applied on the Crystal frame;
5. Vacuum die missing testing technology is adopted;
6. Automatic up & down crystal rings and automatic inspection conveyor system is applied to improve the production efficiency largely;
7. IPC will control the operation of equipment, simplifying the operation of automation equipment;
8. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
9. Precise die bond location and excellent compatibility will guarantee the back-end processing.
Specifications and Parameters
| 1. Production Cycle | 4. Die Bonder’s Swing Arm-and-hand system | ||
| Production Cycle | 60ms (depending on chip size and bracket) | Die Bonder Swing Arm | 126° Rotatable Die Bond with double arms |
| Accuracy (with die correcting feature) | ± 1mil (±0.025mm) | Die Bond Pressure | 20g – 250g (Adjustable) |
| Die Rotation | ± 1° | 5. Loading Workbench | |
| 2. Chip XY Workbench | Range of Stroke | 100mm*300mm | |
| Chip Dimensions |
5mil×5mil-80mil×80mil (0.13mm*0.13mm-2.0mm*2.0mm) |
XY Resolution | 0.02mil (0.5μm) |
| 6. Suitable Holder Size | |||
| Max. Angle Correction | 360° | Length | 150mm ~ 300mm |
| Max. Chip Ring Size | 6” - 7” | Width | 50mm ~ 100mm |
| Max. Chip Area | 4” (101mm) - 5” (127mm) | 7. Facilities Needed | |
| Resolution Ratio | 0.04mil (1μm) | Voltage/Frequency | 220V AC±5%/50HZ |
| Thimble Z Height Stroke | 80mil (2mm) | Compressed Air | 0.5MPa (MIN) |
| Rated Power | 1000W | ||
| 3. Image Recognition System | Gas Consumption | 5L/min | |
| Image Identification | 256 grayscale | 8. Volume and Weight | |
| Resolution | 656 x 492 pixels | Length x Width x Height | 192 × 85 ×180cm |
| Image Recognition Accuracy |
± 0.025mil@50mil Observation Range |
Weight | 1250kg |
